1. 2. 3. material content data sheet sales product name bsf450ne7nh3 issued 4. september 2015 ma# ma001389732 package mg-wdson-2-1 weight* 49.87 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.774 3.56 3.56 35580 35580 leadframe non noble metal copper 7440-50-8 45.429 91.11 91.11 911044 911044 leadfinish non noble metal nickel 7440-02-0 0.121 0.24 2429 noble metal silver 7440-22-4 0.482 0.97 1.21 9663 12092 plating non noble metal nickel 7440-02-0 0.121 0.24 0.24 2429 2429 glue plastics epoxy resin - 0.107 0.21 2142 noble metal silver 7440-22-4 0.656 1.32 1.53 13160 15302 solder non noble metal copper 7440-50-8 0.005 0.01 107 noble metal silver 7440-22-4 0.032 0.06 641 non noble metal tin 7440-31-5 1.028 2.06 2.13 20606 21354 passivation plastics epoxy resin - 0.110 0.22 0.22 2199 2199 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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